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专利名称：COMPOSITION FOR ENCAPSULATION FILM,
ENCAPSULATION FILM, AND ELECTRONICDEVICE COMPRISING THE SAME (AsAmended)
发明人：Jung Sup SHIM,Yoon Gyung CHO,Suk Ky
CHANG,Hyun Jee YOO,Seung Min LEE,KyungYuI BAE
申请号：US14899978申请日：20140618
公开号：US20160149131A1公开日：20160526
摘要：This application involves a kind of thin film packaging material, encapsulatingmaterial film, and the electronic device including it. In this application, encapsulatingmaterial film can be provided with excellent moisture barrier properties, handlingproperties, machinability and excellent in te pins of durability, and structure, including anelement, film is encapsulated in by sealing material.
申请人：LG CHEM, LTD.
地址：Seoul KR
国籍：KR
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