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专利名称：Chemical mechanical planarization slurry and
method for forming same
发明人：Ian T. Sines,Angela Kwapong,Carlijn L.
Mulder,Douglas E. Ward,Vianney Le Roux
申请号：US15710897申请日：20170921公开号：US10329455B2公开日：20190625
摘要：A CMP slurry including a carrier, a particulate material within the carrierincluding an oxide, carbide, nitride, boride, diamond or any combination thereof, anoxidizer including at least one material selected from the group of peroxides,persulfates, permanganates, periodates, perchlorates, hypocholorites, iodates,peroxymonosulfates, cerric ammonium nitrate, periodic acid, ferricyanides, or anycombination thereof, and a material removal rate index (MRR) of at least 500 nm/hr andan average roughness index (Ra) of not greater than 5 Angstroms according to theStandardized Polishing test.
申请人：SAINT-GOBAIN CERAMICS & PLASTICS, INC.
地址：Worcester MA US
国籍：US
代理机构：Abel Schillinger, LLP
代理人：Adam Keser
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