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专利名称：Lead-frame发明人：Pieter Offeringa申请号：US14691100申请日：20150420公开号：US09786585B2公开日：20171010
专利附图：
摘要：One example discloses a lead-frame, comprising: a die-pad having a die couplingsurface; a set of terminals each having an outer terminal edge and an inner terminal edge;wherein the outer terminal edge faces away from the die-pad and the inner terminaledge faces toward the die-pad; and a terminal connector having a first side coupled to
the inner terminal edge and a second side coupled to the die-pad.
申请人：NXP B.V.
地址：Eindhoven NL
国籍：NL
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