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专利名称：CURABLE RESIN COMPOSITION AND CURED
PRODUCT THEREOF, SEALING MATERIALFOR OPTICAL SEMICONDUCTOR, DIEBONDING MATERIAL, AND OPTICALSEMICONDUCTOR LIGHT-EMITTINGELEMENT
发明人：KAJI SATORU,WATANABE RYOKO,KODAMA
TAMOTSU
申请号：EP14793985申请日：20140501公开号：EP2995634A4公开日：20160525
摘要：The present invention relates to a curable resin composition comprising (A) anepoxy compound having three or more epoxy groups in one molecule and (B) an activehydrogen compound.
申请人：ASAHI KASEI CHEMICALS CORPORATION
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