Coating film forming method and apparatus

专利名称：Coating film forming method and apparatus发明人：Tomohide Minami,Shinichi

Sugimoto,Takahiro Kitano,JunOokura,Hiroaki Kurishima

申请号：US11091760申请日：20050329公开号：US07510611B2公开日：20090331

专利附图：

摘要：A coating solution is sprayed on a rotating wafer held horizontally from anozzle provided above the wafer while the nozzle is travelling over the wafer from a

wafer center to a wafer outer area, thus spirally spraying the coating solution on thewafer. The nozzle stops when the coating solution has reached the wafer outer area andthe coating solution is sprayed in circle on the wafer outer area while the wafer is

rotating. A coating solution including a component of a coating film and a solvent may besprayed on a first area to be coated of the wafer and the coating solution and a solventfor the coating film may be sprayed on a second edge area located outside the first areaof the wafer.

申请人：Tomohide Minami,Shinichi Sugimoto,Takahiro Kitano,Jun Ookura,HiroakiKurishima

地址：Koshi-Machi JP,Kikuyo-Machi JP,Koshi-Machi JP,Koshi-Machi JP,Koshi-Machi JP

国籍：JP,JP,JP,JP,JP

代理机构：Oblon, Spivak, McClelland, Maier & Neustadt, P.C.

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