Method and apparatus for grounding a heat sink in

专利名称：Method and apparatus for grounding a heat

sink in thermal contact with an electroniccomponent using a grounding spring havingmultiple-jointed spring fingers

发明人：Don Alan Gilliland,Max John Christopher

Koschmeder

申请号：US11266743申请日：20051103

公开号：US20070097653A1公开日：20070503

专利附图：

摘要：A grounding spring for electromagnetic interference (EMI) suppression isinterposed between a heat sink and a printed circuit board (PCB). The grounding springcomprises a conductive material having an opening formed at its base through which theheat sink makes thermal contact with an electronic module mounted on the PCB. Thebase makes electrical contact with a peripheral surface of the heat sink, and multiple-jointed spring fingers extend from the base to make electrical contact with conductivepads on the PCB. During compression, the movement of each spring finger's tip issubstantially limited to the z-axis. Accordingly, the final installed location of the tip canbe precisely controlled even when the grounding spring must accommodate a widevariety of installed heights of the heat sink relative to the PCB. Preferably, the springfingers terminate with a concave tip that is less susceptible to sliding off the conductivepads.

申请人：Don Alan Gilliland,Max John Christopher Koschmeder

地址：Rochester MN US,Oronoco MN US

国籍：US,US

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