Leadframe and semiconductor package with improved

专利名称：Leadframe and semiconductor package with

improved solder joint strength

发明人：Tae Heon Lee,Young Suk Chung,Mu Hwan

Seo

申请号：US09687048申请日：20001013公开号：US07102208B1公开日：20060905

专利附图：

摘要：A semiconductor leadframe and a semiconductor package using same. Moreparticularly, a semiconductor leadframe offering improved solder joint strength between

a semiconductor package and a motherboard is disclosed. The leadframe comprises aplate-type frame body; a chip paddle on which a semiconductor chip may be mounted; aplurality of internal leads located radially and spaced at regular intervals about theperimeter of the chip paddle; external leads extending outward from the internal leadsand with their terminals connecting to the frame body; and dam bars at the juncture ofeach external and internal lead for additional support and to ensure that the externalleads remain exposed during subsequent encapsulation processes. The leadframe of thepresent invention providing additional solder joint strength through the use of internalleads having different lengths or surface areas.

申请人：Tae Heon Lee,Young Suk Chung,Mu Hwan Seo

地址：Kuri-shi KR,Seoul KR,Aspen Heights SG

国籍：KR,KR,SG

代理机构：Stetina Brunda Garred & Brucker

更多信息请下载全文后查看