Method of metallizing a ceramic substrate

专利名称：Method of metallizing a ceramic substrate发明人：Werner F. Heim,Hunter L. McDowell申请号：US06/259873申请日：19810501公开号：US04342632A公开日：19820803

摘要：A ceramic substrate is metallized by a method including the steps of:

(A) chemically cleaning the substrate,

< P>(B) sputter etching the chemically cleaned substrate,

< P>(C) sputtering a chromium layer of about 200 angstroms in thickness onto thesubstrate,

(D) sputtering a molybdenum layer of about 3500 angstroms in thickness onto thechromium layer,

< P>(E) sputtering a copper layer of about 25,000 angstroms in thickness onto themolybdenum layer,

(F) firing the coated substrate in dry hydrogen at about 1000° C. for about 10 minutes,

(G) plating a copper-silver brazing alloy of about 0. 0003 inch in thickness onto thecopper layer, and< P>

(H) firing in dry hydrogen at about 700° C. for about 10 minutes.

申请人：THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF

THE ARMY

代理人：Nathan Edelberg,Jeremiah G. Murray,Roy E. Gordon

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