Wafer chuck and chuck ring

专利名称：Wafer chuck and chuck ring发明人：河田 和宏申请号：JP2019091921申请日：20190515公开号：JP6651208B1公开日：20200219

摘要：The air does not fill between the dicing tape and the transparent table. A waferchuck mounted on the dicing tape 13 is a chuck chuck 20A having an opening formedtherein, an expansion ring 30 closely adhered to the outer peripheral surface of thechucking ring 20a, and a gasket for closing the opening and placing the wafer The chuckring 20A is provided with an air passage hole 21 in the vicinity of the dicing tape 13.Thedicing tape 13 is interposed between the inner circular member 31 and the outer circularmember 32 constituting the expander ring 30.Diagram

申请人：ハイソル株式会社

地址：東京都台東区上野１丁目１７番６号

国籍：JP

代理人：特許業務法人磯野国際特許商標事務所

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