CM6205;中文规格书,Datasheet资料

EMI Filters with ESDProtection for Audio

Description

The CM6205 is a 3x2, 5−bump EMI filter with ESD protectiondevice for an audio interface in a CSP form factor, 0.4 mm pitch. TheCM6205 is fully compliant with IEC 61000−4−2 and is also RoHSIIcompliant.

Features

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•This Device is Pb−Free, Halogen Free/BFR Free and is RoHS

Compliant

WLCSP−5CASE 567CC

PACKAGE PINOUT

1

A1 CornerIndicator

A12A2B2

ABC

A1

C1C2

Figure 1. Electrical Schematic

(Bottom View)

MARKING DIAGRAM

OrientationMarking

5yw5yw= CM6205= Date Code

ORDERING INFORMATION

See detailed ordering and shipping information in the packagedimensions section on page 5 of this data sheet.

© Semiconductor Components Industries, LLC, 2011

February, 2011 − Rev. 0

1

Publication Order Number:

CM6205/D

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CM6205

Pin Information

Table 1. PIN DESCRIPTIONS

PinA1

Channel 1 Internal

Description

PinA2B2

C1

Channel 2 Internal

C2

Channel 1 ExternalGND

Channel 2 External

Description

Electrical Specifications and Conditions

Table 2. PARAMETERS AND OPERATING CONDITIONS

Parameter

Storage Temperature RangeOperating Temperature RangePower Dissipation per Channel

Rating−55 to +150−40 to +85

100

Units°C°CmW

Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)

SymbolR1, R2C1, C2ILEAKVBRVESD

ResistancePin Capacitance

Leakage Current per ChannelBreakdown Voltage (Positive)Breakdown Voltage (Negative)ESD Protection Peak DischargeVoltage at A2 and C2 pinsa) Contact discharge perIEC 61000−4−2 standardb) Air discharge per

IEC 61000−4−2 standardESD Protection Peak Discharge Voltage at A1 and C1 pinsa) Contact discharge perIEC 61000−4−2 standardb) Air discharge per

IEC 61000−4−2 standard

At 1 MHz, VIN = 0 VVIN = 5 V, other pins floatingIR = +1 mAIR = −1 mA(Note 2)

±15±15

(Note 2)

±2±2

kV

14

−14

Parameter

Conditions

Min13.

Typ1551.0

Max16.56100

UnitsWnFnAVVkV

1.All parameters specified at TA = 25°C unless otherwise noted.

2.Standard IEC 61000−4−2 with CDischarge = 150 pF, RDischarge = 330 W.

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2

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CM6205

Performance Information

Figure 2. Typical Insertion Loss (Bias = 0 V, TA = 25°C; 50 W Environment)

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3

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CM6205

Vertical Structure Specification*

VERTICAL STRUCTURE DIMENSIONS (nominal)

Ref.ahd

ParameterDie ThicknessRepassivationUBM−(Ti/Cu)

MaterialSiliconPolyimidePlated CuSputtered CuSputtered Ti

ebf

UBM Wetting AreaDiameterBump StandoffSolder Bump Dia-meter after BumpReflow

Metal Pad HeightMetal Pad Diameter

AlSiCu

Dimension396 mm10 mm7.0 mm0.4 mm0.1 mm240 mm194 mm270 mm

cg

1.5 mm284 mm0.406 mm

Figure 3. Sectional View

*Daisy Chain CM6004

D2D1

Finished Thickness

0.600 mm

Table 4. CSP TAPE AND REEL SPECIFICATIONS †

Part NumberCM6205

Chip Size (mm)1.20 X 0.80 X 0.60

Pocket Size (mm)B0 X A0 X K01.35 X 0.95 X 0.70

Tape Width

W8 mm

Reel Dia.178 mm (7″)

Qty Per Reel

5000

P04 mm

P14 mm

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecification Brochure, BRD8011/D.

+++Figure 4. Tape and Reel Mechanical Data

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4

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CM6205

PACKAGE DIMENSIONS

WLCSP5, 0.80x1.20CASE 567CC−01

ISSUE O

2X2X

0.05C0.05CDABPIN A1REFERENCEENOTES:

1.DIMENSIONING AND TOLERANCING PERASME Y14.5M, 1994.

2.CONTROLLING DIMENSION: MILLIMETERS.3.COPLANARITY APPLIES TO SPHERICALCROWNS OF SOLDER BALLS.

DIMAA1A2bDEeMILLIMETERSMINMAX0.570.630.170.240.41 REF0.240.290.80 BSC1.20 BSC0.40 BSCTOP VIEW

A20.05CA0.05CNOTE 3RECOMMENDED

SOLDERING FOOTPRINT*

CSEATINGPLANE

A1SIDE VIEW0.40PITCHPACKAGEOUTLINE5XbABC12eeA10.40PITCH5X0.05CAB0.03C0.25DIMENSIONS: MILLIMETERS

BOTTOM VIEW

*For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.

Ordering Information

Table 5. PART NUMBERING INFORMATION

Bumps5

PackageCSP−SAC105

Ordering Part Number (Note 3)

CM6205

Part Marking (Date Code)

5yw

3.Parts are shipped in Tape and Reel form unless otherwise specified.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liabilityarising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. Alloperating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rightsnor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. ShouldBuyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an EqualOpportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

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分销商库存信息:

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