Thermal conductive insert for sandwich structures

专利名称：Thermal conductive insert for sandwich

structures

发明人：Steven M. Lunde,Paul D. Nedervelt申请号：US09/081714申请日：19980518公开号：US06055790A公开日：20000502

摘要：In a sandwich structure having a honeycomb core between a pair of compositeface sheets, an insert is provided that passes through such structure. The insertterminates in an opening, flush or below the top face sheet and has a flange whichoverlaps and contacts the face sheet from below. Such opening can receive attachinghardware and a fastener which clamps the attaching hardware against the face sheet andthe flange below, for good thermal conductivity between attaching hardware and theface sheet and thus the core and the bottom face sheet of the sandwich structure. Thispermits a heat source mounted, e.g., in a spacecraft, to a sandwich wall by attachinghardware, to more readily discharge excess heat through such wall and to an exteriorface sheet for improved heat conduction and radiation therefrom.

申请人：THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OFTHE AIR FORCE

代理人：Thomas C. Stover

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